Development of Semiconductor Manufacturing Equipment Components Using Joining and Ceramic Technologies
First written in FY2018. 3 of 5 entries say "Restated". Latest entry: FY2026.
No other company in this theme has enough history to compare yet.
- FY2026RestatedAnnual report
「For upper components of semiconductor manufacturing equipment using solid-state diffusion bonding technology, we have achieved the provision of high-cleanliness products that reduce the risk of contamination to an absolute minimum.」
The company continues to improve the cleanliness of semiconductor manufacturing equipment components through bonding technology. - FY2023RestatedAnnual report
「For upper components of semiconductor manufacturing equipment using solid-state diffusion bonding technology, we have achieved the provision of high-cleanliness products that reduce the risk of contamination to an absolute minimum.」
The company continues to improve the cleanliness of semiconductor manufacturing equipment components through bonding technology and other methods. - FY2022RestatedAnnual report
「For upper components of semiconductor manufacturing equipment using solid-state diffusion bonding technology, we have achieved the provision of high-cleanliness products that reduce the risk of contamination to an absolute minimum.」
The company continues to improve the quality of semiconductor manufacturing equipment components using bonding technology, ceramic thermal spraying and other technologies. - FY2020AdvancedAnnual report
「For upper components of semiconductor manufacturing equipment using solid-state diffusion bonding technology, we have achieved the provision of high-cleanliness products that reduce the risk of contamination to an absolute minimum.」
The company states that it has achieved the provision of high-cleanliness semiconductor manufacturing equipment components using bonding technology. - FY2018First statedAnnual report
「In addition to brazing, we are developing highly reliable, contamination-free metal heaters and cooling plates using diffusion bonding and cold-spray technologies. We are also applying ceramic thermal-spraying technology to improve insulation and temperature uniformity and accommodate larger sizes, maintaining the industry's leading share of the North American heater market.」
The company describes the development of semiconductor manufacturing equipment components using brazing, diffusion bonding, cold spraying and ceramic thermal spraying, as well as the maintenance of its market share in North America.