ONE-WAYOngoing theme · still written in the latest filings
Joining and ceramic technology development for semiconductor manufacturing equipment components
Ongoing technology development to improve the cleanliness and functionality of semiconductor manufacturing equipment components using brazing, diffusion bonding, cold spray, ceramic thermal spraying and other technologies. This also includes maintaining market share in North America.
Companies1How many companies write about this.
Threads1One company can carry more than one thread here.
PeriodFY2018 →Still being written about.
Directionhelps1 helps · 0 hurts · 0 flat