Development of Plating Technology for Next-Generation Semiconductors and Packaging
First written in FY2016. 5 of 8 entries say "Restated". Latest entry: FY2026.
No other company in this theme has enough history to compare yet.
- FY2026RestatedAnnual report
「In the electronic components and other industries, we will launch high-value-added products such as plating solutions for high-end semiconductors and expand the market, thereby increasing sales of high-value-added products and gross profit.」
The company has reaffirmed its policy of launching plating solutions for advanced and high-end semiconductors and expanding the market. - FY2025RestatedAnnual report
「In the electronic components and other industries, we will launch high-value-added products such as plating solutions for advanced semiconductors and expand the market, thereby increasing sales of high-value-added products and gross profit.」
The company has reaffirmed its policy of launching high-value-added products, including plating solutions for advanced semiconductors, on the market. - FY2019AdvancedAnnual report
「In addition, copper plating solutions for wafers compatible with fan-out technology and copper pillar formation performed steadily, supported by mass production in Taiwan and increased production in South Korea.」
For copper plating solutions for wafers compatible with fan-out technology and copper pillar formation, the report describes specific progress in production, namely mass production in Taiwan and increased production in South Korea. - FY2019-Q3RestatedAnnual report
「In addition, electroless tin plating solutions for LCD drivers and copper plating solutions for wafers compatible with fan-out technology and copper pillar formation also performed well.」
Reports strong performance by copper plating solutions for wafers compatible with fan-out technology and copper pillar formation. No new customers or progress in the development stage is indicated. - FY2018-Q3RestatedAnnual report
「There was also adoption of copper plating solutions for wafers compatible with fan-out technology and copper pillar formation,」
The adoption of copper plating solutions for wafers compatible with fan-out technology and copper pillar formation is reiterated. Adoption had already been disclosed in the previous quarter, and no new customer or stage milestone is indicated. - FY2018-Q1AdvancedAnnual report
「Business remained strong in domestic and overseas markets, supported by robust demand for plating solutions for general electronic components used in automotive-related semiconductors and large televisions compatible with 4K and OLED, as well as adoption of copper plating solutions for wafers compatible with fan-out technology in semiconductors.」
The disclosure states that copper plating solutions for wafers compatible with fan-out technology were adopted, providing a specific adoption record for plating technology for next-generation semiconductors and packages. - FY2017RestatedAnnual report
「The Group is developing electrolytic copper plating solutions compatible with all manufacturing methods.」
The company describes a policy of developing electrolytic copper plating solutions compatible with multiple manufacturing methods, including fan-out packaging, as well as tin-based plating solutions for next-generation package substrates. - FY2016First statedAnnual report
「To meet these needs, we are developing high-performance tin-silver plating processes and other technologies, as well as next-generation bonding materials. To support further increases in density, we are also developing an electrolytic copper plating process for forming pillars beneath tin-based bump electrodes, which has already been adopted by some users.」
First disclosed. The research and development themes include multiple plating-process developments for tin-based bumps, copper pillars and next-generation package substrates.