PIM orders for high-performance components fell short of target due to the global decline in demand for semiconductor manufacturing equipment and machine tools
First written in FY2020-Q3. 12 of 20 entries say "Mitigated", first in FY2022-Q1. Latest entry: 2026-11-13.
The whole theme swung hardest in 2023: 11 of 20 companies on the "Worse" side.
10 other companies' latest entry also says "Mitigated".
- 2026-11-13MitigatedEarnings presentation
「半導体製造装置およびデータセンター設備向け高機能部品の受注が堅調に推移」
半導体製造設備等向け高機能部品の受注が堅調に推移し、PIM高機能部品の受注低迷リスクは一段緩和された。 - FY2026MitigatedAnnual report
「In the PIM business, stable ongoing orders for automotive turbo components and high-performance components drove sales to a record high since the Company’s founding.」
Regarding the risk to orders for high-performance components from weak demand for semiconductor manufacturing equipment and machine tools, stable ongoing orders for automotive turbo components and high-performance components resulted in record-high PIM sales since the Company’s founding. - FY2025MitigatedAnnual report
「Sales of high-performance components for industrial equipment, including the core PIM binder products, ceramic components for CMOS sensors, linear-motion bearings and ball-screw components, also remained solid.」
Regarding high-performance components whose orders had been weak due to sluggish demand for semiconductor manufacturing equipment and other products, sales of binders, CMOS sensor components, linear-motion bearings and ball-screw components remained solid. - FY2025-H1MitigatedAnnual report
「In the PIM business, sales of high-performance components recovered as capital investment conditions improved, and the resumption of mass-production shipments of automotive components resulted in a substantial increase in revenue.」
Sales of PIM high-performance components, whose orders had been weak due to sluggish demand for semiconductor manufacturing equipment and other products, recovered as the capital investment market improved. Mass-production shipments of automotive components also resumed, partially mitigating the related order risk. - FY2024WorsenedAnnual report
「Orders for high-performance components remained weak for ceramic components for CMOS sensors and linear-motion bearings, while some components, including ball-screw products, showed signs of recovery, supported by strong demand for semiconductor manufacturing equipment and other products.」
Although some high-performance components recovered, orders for CMOS sensor components and linear-motion bearing-related products remained weak, resulting in lower sales and an operating loss in the PIM business. - FY2024-Q3WorsenedAnnual report
「Orders for high-performance components, including ceramic components for CMOS sensors and ball-screw components, remained weak due to the decline in demand for semiconductor manufacturing equipment and other products, resulting in lower sales.」
Demand for semiconductor manufacturing equipment and other products continued to decline, and orders for ceramic components for CMOS sensors and ball-screw components remained weak. The impact has materialized as lower sales and an operating loss in the PIM business. - FY2024-Q2WorsenedAnnual report
「Orders for high-performance components, including ceramic components for CMOS sensors and ball-screw components, also trended downward, resulting in lower sales.」
Orders for ceramic components for CMOS sensors and ball-screw components, among the high-performance components whose orders had expanded through the previous fiscal year against a backdrop of recovering demand for semiconductor manufacturing equipment and machine tools, began to decline. - FY2024-Q1MitigatedAnnual report
「Orders for high-performance components, including ceramic components for CMOS sensors and ball-screw components, also remained strong.」
Regarding the risk of orders for PIM high-performance components falling short of target due to weak demand for semiconductor manufacturing equipment and machine tools, orders for ceramic components for CMOS sensors and ball-screw components remained strong. - FY2023MitigatedAnnual report
「Against a backdrop of expanding demand for semiconductors, advances in automation and increased investment related to EVs, demand for development and manufacturing equipment and related products remained strong. Orders increased substantially for ball-screw components used in general machinery, semiconductor manufacturing equipment, industrial robots, and for material handling and positioning in machine tools, as well as for high-performance components used in ceramic CMOS sensors.」
The shortfall in orders for PIM high-performance components due to weak demand for semiconductor manufacturing equipment and machine tools was mitigated by a substantial increase in orders against a backdrop of expanding demand. - FY2023-Q3MitigatedAnnual report
「Driven by strong demand for semiconductor manufacturing equipment and related products, orders increased substantially for ball-screw components for THK CO.,LTD. used in industrial robots and for material handling and positioning in machine tools, as well as for high-performance components used in ceramic CMOS sensors. Newly ordered linear-motion bearing components are used in industrial robots and for material handling in machine tools, and orders for these products also increased substantially.」
Against a backdrop of recovering demand related to semiconductor manufacturing equipment and machine tools, orders increased substantially for high-performance components and new linear-motion bearing components, further mitigating the risk of orders falling short of target. - FY2023-Q2MitigatedAnnual report
「Driven by strong demand for semiconductor manufacturing equipment and related products, orders for high-performance components used in linear-motion bearings for THK CO.,LTD. and ceramic CMOS sensors increased substantially. Newly ordered ball-screw products are used in industrial robots and for material handling and positioning in machine tools, and orders for these products also increased.」
The recovery in demand related to semiconductor manufacturing equipment and machine tools led to a substantial increase in orders for high-performance components and also generated orders for new ball-screw products. - FY2022MitigatedAnnual report
「In addition, the recovery of the Chinese economy ahead of the rest of the world drove growth in high-performance components such as linear-motion bearings and ceramic CMOS sensors, resulting in record-high sales and operating income since the Company’s founding.」
Regarding the shortfall in orders for high-performance components due to weak demand for semiconductor manufacturing equipment and machine tools, high-performance components grew against a backdrop of the recovery in the Chinese economy, resulting in record-high sales and operating income for the PIM business. - FY2022-Q3MitigatedAnnual report
「Mass-production sales of high-performance components, including linear-motion bearings for THK CO.,LTD. acquired 2 fiscal years ago and ceramic CMOS sensors ordered in the previous fiscal year, increased, while sales of 6 newly ordered molds and other products drove consolidated sales for the 9-month period ended in the third quarter to a record high.」
Regarding the shortfall in orders for high-performance components due to weak demand for semiconductor manufacturing equipment and machine tools, cumulative sales of PIM high-performance components reached a record high as existing mass-production products expanded and 6 new molds were ordered. - FY2022-Q2MitigatedAnnual report
「The prolonged global weakness in demand for semiconductor manufacturing equipment and machine tools is clearly showing signs of recovery, leading to increased orders for linear-motion bearing components and ceramic CMOS sensor components.」
Regarding the shortfall in orders for high-performance components due to weak demand for semiconductor manufacturing equipment and machine tools, global demand is showing signs of recovery, leading to increased orders for linear-motion bearing components and CMOS sensor components. - FY2022-Q1MitigatedAnnual report
「The prolonged global weakness in demand for semiconductor manufacturing equipment and machine tools due to US-China trade friction and COVID-19 is clearly showing signs of recovery, and orders for linear-motion bearings and ceramic CMOS sensor components are expected to gradually recover.」
Regarding the shortfall in orders for high-performance components due to weak demand for semiconductor manufacturing equipment and machine tools, global demand is showing signs of recovery and orders are expected to gradually recover. - FY2021-Q3RestatedAnnual report
「As global demand for semiconductor equipment and machine tools remains weak due to prolonged US-China trade friction and COVID-19, orders for high-performance components, including linear-motion bearings, have not yet recovered. There are some signs of a modest recovery ahead, but the outlook remains uncertain.」
Orders for high-performance components continue to fall short of target due to weak demand for semiconductor equipment and machine tools, although there are some signs of a modest recovery. The Company continues to view the outlook as uncertain. - FY2021-Q2WorsenedAnnual report
「In the PIM business, global demand for semiconductor equipment and machine tools remains weak. Orders for high-performance components acquired as new mass-production products fell substantially below expectations, and there has been no sign of an order recovery since the third quarter of the consolidated fiscal year.」
Orders for high-performance components continue to fall short of target, with no sign of a recovery after the third quarter, indicating that the impact of weak demand is prolonged. - FY2021-Q1RestatedAnnual report
「The rollout into mass production of high-performance components, including the linear-motion bearings acquired in the previous fiscal year, continues to generate orders substantially below expectations, due to the prolonged impact of US-China trade friction and the spread of COVID-19 on semiconductor manufacturing equipment and machine-tool components.」
Orders for high-performance components continue to fall short of target due to weak demand for semiconductor manufacturing equipment and machine tools. - FY2020MaterialisedAnnual report
「As the global decline in demand for semiconductor manufacturing equipment, machine tools and other products continued, orders for high-performance components, including the planned linear-motion bearings, fell substantially below expectations.」
Orders for high-performance components actually fell substantially below expectations due to the global decline in demand for semiconductor manufacturing equipment and machine tools. - FY2020-Q3First statedAnnual report
「As the global decline in demand for semiconductor manufacturing equipment, machine tools and other products continued, orders for high-performance components, including the planned linear-motion bearings, fell substantially below expectations.」
As the global decline in demand for semiconductor manufacturing equipment and machine tools continued, orders for PIM high-performance components fell substantially below expectations.