New Application Development for New Functional Resin Materials
First written in FY2016. 24 of 31 entries say "Restated". Latest entry: 2026-10-09.
The whole theme swung hardest in 2024: 2 of 8 companies on the "Worse" side.
14 other companies' latest entry also says "Advanced".
- FY2026RestatedAnnual report
「For development centered on functional resin composite materials and molding, we are pursuing proposal-based material and molding development as a new means of communicating with customers.」
The company continues to develop proposal-based functional resin composite materials and molding processes through dialogue with customers. - FY2024-Q3ReframedAnnual report
「For solid encapsulants, including the high-heat-resistant, high-thermal-conductivity, low-temperature-curing "Epocluster® Courier," we have supplied samples to domestic semiconductor device manufacturers, but the products have not yet been adopted, and we recognize that entering this industry is extremely difficult. Going forward, we will focus marketing activities on applications in other fields that make use of the features of our products.」
Although sample supplies to domestic semiconductor device manufacturers have continued, the company explicitly states that adoption has not been achieved and entry into the industry is difficult, and has set a policy of focusing applications on other fields where the products' features can be utilized. - FY2024-Q1RestatedAnnual report
「For solid encapsulants, including the high-heat-resistant, high-thermal-conductivity, low-temperature-curing "Epocluster® Courier," deliveries to some customers are continuing, while we continue to expand applications and develop customers by supplying samples to semiconductor device manufacturers, industrial equipment manufacturers and others.」
For solid encapsulants, deliveries to some customers are continuing, while sample supplies to the semiconductor and industrial equipment sectors, application expansion and customer development are also continuing. No new milestone for a transition to mass production is mentioned. - FY2023AdvancedAnnual report
「For solid encapsulants offering high heat resistance, high thermal conductivity and low-temperature curing, we are developing customers mainly in the electronics, industrial equipment and leisure-related fields, actively conducting sample evaluations, and customizing materials for mass production.」
The company specifically states that it is developing customers, evaluating samples and customizing materials for mass production of solid encapsulants. - FY2023-Q3RestatedAnnual report
「For solid encapsulants, including the high-heat-resistant, high-thermal-conductivity, low-temperature-curing "Epocluster® Courier," we are continuing to develop and promote the business while supplying samples to semiconductor device manufacturers, industrial equipment manufacturers and others.」
Sample supplies of solid encapsulants are continuing. No milestones for new application development or a transition to mass production are mentioned. - FY2023-Q2RestatedAnnual report
「For solid encapsulants, including the high-heat-resistant, high-thermal-conductivity, low-temperature-curing "Epocluster® Courier," we are continuing to develop and promote the business while supplying samples to semiconductor device manufacturers, industrial equipment manufacturers and others.」
Sample supplies of solid encapsulants to semiconductor device manufacturers, industrial equipment manufacturers and others are continuing. No new application development or transition to mass production is mentioned. - FY2023-Q1RestatedAnnual report
「For solid encapsulants, including the high-heat-resistant, high-thermal-conductivity, low-temperature-curing "Epocluster® Courier," we are continuing to develop and promote the business while supplying samples to semiconductor device manufacturers, industrial equipment manufacturers and others.」
Sample supplies of solid encapsulants to semiconductor device manufacturers, industrial equipment manufacturers and others are continuing. - FY2022RestatedAnnual report
「For development centered on functional resin composite materials and molding, we are pursuing proposal-based material development as a new means of communicating with customers.」
The company continues to develop new applications through proposal-based material development with customers and through sample evaluation and customization of solid encapsulants. - FY2022-Q3RestatedAnnual report
「For solid encapsulants, including the high-heat-resistant, high-thermal-conductivity, low-temperature-curing "Epocluster® Courier," we are continuing to develop and promote the business while supplying samples to semiconductor device manufacturers, industrial equipment manufacturers and others.」
Sample supplies of solid encapsulants to semiconductor device manufacturers, industrial equipment manufacturers and others are continuing. No new applications or transition to mass production are mentioned. - FY2022-Q2RestatedAnnual report
「For solid encapsulants, including the high-heat-resistant, high-thermal-conductivity, low-temperature-curing "Epocluster® Courier," we are continuing to develop and promote the business while supplying samples to semiconductor device manufacturers, industrial equipment manufacturers and others.」
Sample supplies of solid encapsulants to semiconductor device manufacturers, industrial equipment manufacturers and others are continuing. - FY2022-Q1RestatedAnnual report
「For solid encapsulants, including the high-heat-resistant, high-thermal-conductivity, low-temperature-curing "Epocluster® Courier," we are continuing to develop and promote the business while supplying samples to semiconductor device manufacturers, industrial equipment manufacturers and others.」
Sample supplies of solid encapsulants to semiconductor device manufacturers, industrial equipment manufacturers and others are continuing. - FY2021-Q3RestatedAnnual report
「For solid encapsulants, including the high-heat-resistant, high-thermal-conductivity, low-temperature-curing "Epocluster® Courier," we are continuing to develop and promote the business while supplying samples to semiconductor device manufacturers, industrial equipment manufacturers and others.」
Sample supplies of solid encapsulants to semiconductor device manufacturers, industrial equipment manufacturers and others are continuing. - FY2021-Q2RestatedAnnual report
「For solid encapsulants, including the high-heat-resistant, high-thermal-conductivity, low-temperature-curing "Epocluster® Courier," we are continuing to develop and promote the business while supplying samples to semiconductor device manufacturers, industrial equipment manufacturers and others.」
Sample supplies of solid encapsulants to semiconductor device manufacturers, industrial equipment manufacturers and others are continuing. - FY2021-Q1RestatedAnnual report
「For solid encapsulants, including the high-heat-resistant, high-thermal-conductivity, low-temperature-curing "Epocluster® Courier," we are continuing to develop and promote the business while supplying samples to semiconductor device manufacturers, industrial equipment manufacturers and others.」
Sample supplies of solid encapsulants to semiconductor device manufacturers, industrial equipment manufacturers and others are continuing. - FY2020RestatedAnnual report
「We are developing functional resin composite materials for existing customers' next-generation products together with those customers. For the solid encapsulants under development, including those offering high heat resistance, high thermal conductivity and low-temperature curing, we are advancing the plan from evaluating the physical properties of prototype samples using specially formulated resins and fillers, to trial mold production, and then to mass production and shipment. We are also continuing to develop materials for power devices and motors.」
The company continues to develop functional resin composite materials jointly with customers, pursue plans for the mass production and shipment of solid encapsulants, and develop materials for power devices and motors. - FY2020-Q3RestatedAnnual report
「For solid encapsulants, including the high-heat-resistant, high-thermal-conductivity, low-temperature-curing "Epocluster® Courier," we are continuing to develop and promote the business while supplying samples to semiconductor device manufacturers, industrial equipment manufacturers and others. In the leisure-related field, production is progressing toward mass production.」
The company continues to supply samples of solid encapsulants and promote the transition to mass production in the leisure-related field. - FY2020-Q2RestatedAnnual report
「For solid encapsulants, including the high-heat-resistant, high-thermal-conductivity, low-temperature-curing "Epocluster® Courier," we are continuing to develop and promote the business while supplying samples to semiconductor device manufacturers, industrial equipment manufacturers and others. In the leisure-related field, production is progressing toward mass production.」
The company continues to report sample supplies of solid encapsulants and the transition to mass production in the leisure-related field, reaffirming its application-development policy from the previous fiscal year. - FY2020-Q1RestatedAnnual report
「For solid encapsulants, including the high-heat-resistant, high-thermal-conductivity, low-temperature-curing "Epocluster® Courier," we are continuing to develop and promote the business while supplying samples to semiconductor device manufacturers, industrial equipment manufacturers and others. In the leisure-related field, mass production is progressing smoothly.」
Sample supplies of solid encapsulants are continuing, and mass production is progressing smoothly in the leisure-related field. - FY2019AdvancedAnnual report
「For the solid encapsulants under development, including those offering high heat resistance, high thermal conductivity and low-temperature curing, we are advancing the plan from evaluating the physical properties of prototype samples using specially formulated resins and fillers, to trial mold production, and then to mass production and shipment. We are also continuing to develop materials for power devices and motors.」
The company is continuing to develop applications for solid encapsulants and has explicitly identified materials for power devices and motors as new application areas. - FY2019-Q3AdvancedAnnual report
「For solid encapsulants, including the high-heat-resistant, high-thermal-conductivity, low-temperature-curing "Epocluster® Courier," we are continuing to develop and promote the business while supplying samples to semiconductor device manufacturers, industrial equipment manufacturers and others. In the leisure-related field, some products have moved into mass production.」
Sample supplies of solid encapsulants are continuing, while some products in the leisure-related field have moved into mass production and concrete progress has been made in developing new applications. - FY2018RestatedAnnual report
「The nano/micro technology-related business focuses on developing functional resin composite materials based on customer themes, making technical proposals for customers’ product development, and improving the Pulse Injector® system.」
The company continues to develop applications through the development of functional resin composite materials based on customer themes, technical proposals and improvements to the PIJ system. - FY2018-Q3RestatedAnnual report
「The composite materials business for Epocluster® Courier, a highly thermally conductive insulating material, is continuing to advance. The company continues to explore applications for functional resin composite materials.」
The company continues to advance and explore the composite materials business for Epocluster® Courier and applications for functional resin composite materials. - FY2018-Q2RestatedAnnual report
「The composite materials business for Epocluster® Courier, a highly thermally conductive insulating material, is continuing to advance. The company continues to explore applications for functional resin composite materials.」
The company continues to advance and explore the composite materials business for Epocluster® Courier and applications for functional resin composite materials. - FY2018-Q1RestatedAnnual report
「The composite materials business for Epocluster® Courier, a highly thermally conductive insulating material, is continuing to advance. The company continues to explore applications for functional resin composite materials.」
The company continues to advance the composite materials business for Epocluster® Courier and develop applications for functional resin composite materials. - FY2017RestatedAnnual report
「The development of applications through the expansion of functional resin composite materials is essential.」
The company has once again indicated the need to develop new applications by expanding the use of functional resin composite materials. - FY2017-Q3RestatedAnnual report
「Under these circumstances, the company advanced the development of “white materials for LEDs” and their modules in its advanced equipment investment business, as well as “Epocluster® Courier,” a high-thermal-conductivity insulating material for next-generation high-density devices, as new products based on proprietary technology founded on nanotechnology. At the same time, it promoted new applications for existing products and the development of new fields and customers through their integration with nanotechnology.」
The company continues to develop new products based on its proprietary technologies and develop new fields and customers by combining nanotechnology capabilities. - FY2017-Q2RestatedAnnual report
「Under these circumstances, the company advanced the development of “white materials for LEDs” and their modules in its advanced equipment investment business, as well as “Epocluster® Courier,” a high-thermal-conductivity insulating material for next-generation high-density devices, as new products based on proprietary technology founded on nanotechnology. At the same time, it promoted new applications for existing products and the development of new fields and customers through their integration with nanotechnology.」
The company continues to develop new products based on its proprietary technologies and develop new fields by combining nanotechnology capabilities. - FY2017-Q1RestatedAnnual report
「The company promoted the development of new fields and new customers through new applications for existing products and their integration with nanotechnology.」
The company continues to develop new fields by combining nanotechnology capabilities. - FY2016First statedAnnual report
「We must further advance the development of new applications by expanding the use of our proprietary functional resin materials, our one-of-a-kind technology.」
A measure to develop new applications centered on the company’s proprietary functional resin materials.