This transaction
Share acquisition (making the company a subsidiary)Manufacture and sale of epoxy resin molding compounds for semiconductor encapsulation, bonding pastes for semiconductors, industrial resins and other products
The impact on consolidated results for the fiscal year ending March 2027 has already been incorporated into the revised consolidated earnings forecast.
| Item | Details |
|---|---|
| Transaction name | Share acquisition (making the company a subsidiary) |
| Counterparty name | KYOCERA CORPORATION |
| Name of the Subject Company | 住友ベークライトケミカルソリューション株式会社 |
| Business Description of the Subject Company | Manufacture and sale of epoxy resin molding compounds for semiconductor encapsulation, bonding pastes for semiconductors, industrial resins and other products |
| Location of the Subject Company | Shinagawa-ku, Tokyo |
| Capital Stock of the Subject Company | ¥200 million |
| Date of Establishment of the Subject Company | 9 July 2026 |
| Number of shares acquired | All shares (number of shares: Not disclosed) |
| Impact on Business Performance | The impact on consolidated results for the fiscal year ending March 2027 has already been incorporated into the revised consolidated earnings forecast. |
| Execution Date / Effective Date | 30 October 2026 (completed) |
| Management structure after acquisition | The company name is 住友ベークライトケミカルソリューション株式会社, and the representative director and president is Mori Ken (森健). Treatment of employees: Not disclosed |
Items this document does not state (21)
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.To acquire part of the chemical business operated by KYOCERA CORPORATION, 住友ベークライト acquired all shares in a company newly established by KYOCERA CORPORATION to succeed to that business through an absorption-type company split.