Total Solutions through Engineering and Platform Capabilities
First written in FY2024. 5 of 8 entries say "Advanced", first in FY2025-H1. Latest entry: 2026-10-15.
2 other companies' latest entry also says "Advanced".
- FY2025RaisedAnnual report
「Going forward, based on the knowledge and experience we have accumulated, we aim to expand our service offering into the sale of semiconductor manufacturing equipment and auxiliary facilities, as well as post-installation maintenance and other services. By combining these with our existing services, we aim to provide higher-value-added solutions.」
The Company explicitly stated its policy of expanding beyond parts sales and repair and equipment sales to include sales of equipment and auxiliary facilities and post-installation maintenance. - FY2025-H1AdvancedAnnual report
「In particular, within our semiconductor manufacturing field solutions business, projects involving equipment disassembly and removal increased, driving demand for our engineering capabilities. To address the severe labor shortage in the semiconductor industry, we have also launched new platforms, including an owned media site and a talent-matching site, and are continuing to develop them. With our platform and engineering capabilities as two core pillars, we will continue working to expand our business performance.」
Demand for engineering capabilities increased as projects involving equipment disassembly and removal grew. The platform and engineering businesses continue to serve as the two core pillars. - FY2024First statedAnnual report
「Against this backdrop, we provide both a cross-border e-commerce platform that consolidates parts and equipment information and our engineering capabilities as an end-to-end solution.」
A strategy combining digital infrastructure with equipment-related technical expertise.