ONE-WAYOngoing theme · still written in the latest filings

Entry into the Semiconductor Advanced Packaging Inspection Business

A project aimed at entering the inspection market by commercializing advanced measurement technologies and AI-based inspection algorithms for advanced packaging used in next-generation AI chips.

Companies3How many companies write about this.

Threads3One company can carry more than one thread here.

PeriodFY2024 →Still being written about.

Directionhelps3 helps · 0 hurts · 0 flat