ONE-WAYOngoing theme · still written in the latest filings
Development of lead frames for automotive, LED, and power semiconductor applications
An initiative to develop and roll out lead frames for packaging applications in automotive, LED, QFN, information and communications, 5G, and power semiconductor markets, leveraging precision machining technology.
Companies1How many companies write about this.
Threads1One company can carry more than one thread here.
PeriodFY2018 →Still being written about.
Directionhelps1 helps · 0 hurts · 0 flat