ONE-WAYOngoing theme · still written in the latest filings
Development of High-Rigidity, High-Throughput Processing Equipment for Specialty Materials
An initiative to develop high-rigidity, high-throughput processing equipment and next-generation models for grinding, lapping and polishing SiC, GaN, LT, LN and other specialty materials. This is also expected to contribute to increased sales and orders for semiconductor-related equipment.
Companies3How many companies write about this.
Threads3One company can carry more than one thread here.
PeriodFY2016 →Still being written about.
Directionhelps3 helps · 0 hurts · 0 flat