In Japan's semiconductor packaging market, the adoption of advanced packaging technologies and chiplet integration are progressing, while demand for products incorporating HBM is expanding, creating business opportunities in next-generation semiconductor manufacturing.
In the Japanese market, the adoption of advanced packaging technologies is expected to drive innovation in product design and manufacturing processes. Accordingly, the use of structures incorporating chiplets is expected to expand.
Demand is expected to increase for high-performance packages using HBM (high-bandwidth memory), which is attracting attention as a factor supporting improvements in semiconductor device performance.
Efforts related to next-generation semiconductor manufacturing are said to be creating market opportunities, and companies are moving to adopt new packaging technologies and strengthen their supply chains.