Resonac and Kioxia are advancing an initiative to recycle and recover the high-purity solvents used in the semiconductor wafer cleaning process, with CFP usage reduced by 70%.
Resonac and Kioxia are jointly advancing the development and demonstration of technology to recycle and recover high-purity solvents for semiconductor manufacturing processes. The technology is reportedly being applied to the wafer cleaning process.
As a result of the recycling and recovery technology, CFP usage has reportedly been reduced by approximately 70%.