東亞合成 announced plans to launch a heat-resistant UV-release adhesive for semiconductors. The launch timing has not been determined, and enhanced heat resistance is cited as a key feature.
東亞合成 has disclosed plans to launch a new heat-resistant UV-release adhesive for use in semiconductor manufacturing processes. The product is characterised as having greater heat resistance than existing products and is expected to be used in the bonding and release processes for semiconductor components.
Specific product specifications, the launch timing and supply regions have not been determined, according to the article. At this stage, the description is limited to an improved UV-release adhesive designed to enhance heat resistance. Further details are expected to be provided in future official announcements.