Honda's paper website has published a report on the reliability evaluation and practical application of Pb-free solder. Sn-Ag-Cu solder was shown to potentially outperform Sn-Pb solder in thermal-fatigue life, and its application to a keyless-entry transmitter is said to have met quality and durability requirements.
The reliability of Pb-free solder was evaluated as an alternative to Sn-Pb solder, which is widely used as a soldering material. The evaluation covered five areas: thermal fatigue, intermetallic compounds, creep and vibration fatigue, and ion migration.
It was confirmed that, as a Pb-free solder, Sn-Ag-Cu solder offers better thermal-fatigue life than Sn-Pb solder under typical operating temperatures.
Sn-Ag-Cu solder was applied to a keyless-entry transmitter as a product, and the application met manufacturing-quality and durability requirements.