Nikon announced that it will launch the DSP-110 digital exposure system for semiconductor advanced packaging in April 2027, with a resolution of 1.5 µm (L/S). Throughput will be approximately 40% higher than that of the DSP-100, reaching 72 panels/hour.
Nikon announced plans to launch the DSP-110 digital exposure system for the semiconductor advanced packaging market, offering a resolution of 1.5 µm (L/S). The system can support large substrates, and sales are scheduled to begin in April 2027. By redesigning its optical system from the DSP-100, the DSP-110 is expected to increase throughput by approximately 40%, offering processing capacity of 71–72 panels/hour.
The development is driven by growing demand for equipment capable of supporting high-density wiring as demand for RDL (redistribution layer) exposure technology expands. Nikon says it has pursued technological development to achieve both high resolution and productivity by leveraging its strength in designing and manufacturing optical systems in-house.
The DSP-110 offers a resolution of 1.5 µm (L/S), an i-line-equivalent light source and overlay accuracy of no more than ±0.3 µm. It is designed to support multiple substrate sizes, including square substrates and wafers. At the time of the announcement, throughput of 72 panels/hour was expected to be achieved on 510 × 515 mm substrates.
Its main features are: 1) approximately 40% higher throughput than the DSP-100, 2) an expanded focus margin, and 3) support for future higher-resolution upgrades through optical-system replacement. The expanded focus margin is expected to enable stable patterning and improve yield even in cases involving different substrate conditions.