田中精密工業 announced on the 15th that it had entered a capital and business alliance with Nagoya University startup U-MAP. The companies aim to commercialize cooling components for next-generation power semiconductors by 2030, combining U-MAP’s heat-dissipating materials with 田中精密工業’s precision processing technology.
田中精密工業 announced on the 15th that it had signed a capital and business alliance agreement with Nagoya University startup U-MAP. 田中精密工業 will combine its manufacturing expertise developed through the production of automotive components with heat-dissipating materials developed and produced by U-MAP.
U-MAP develops and produces Thermal Knight, a lightweight heat-dissipating material designed to improve the heat dissipation of equipment. 田中精密工業 will subscribe to a third-party allotment of new shares, with the investment amount undisclosed.
The two companies will work together on validation toward practical implementation, in light of the increasing output and density of power semiconductors accompanying the spread of EVs and growing demand for data centers. They aim to develop products weighing half as much as existing automotive cooling components, while also designing products to meet individual customer requirements.
The companies aim to commercialize cooling components for next-generation power semiconductors by 2030. They plan to jointly verify the mass-production potential and cost of the lightweight, high-performance cooling components they develop.