Seiren Co., Ltd. has developed a thin, film-like electromagnetic shielding material intended for use in automotive equipment and drones. The material features a conductive film structure for 3D molding and is said to offer substantial weight savings and high shielding performance compared with conventional materials.
Seiren Co., Ltd. has developed an ultra-lightweight, film-like electromagnetic shielding material. The new material is thin and can be molded into complex shapes, with weight reduction and high shielding performance cited as its key features when used in shielding cases.
The new material consists of a conductive film for 3D molding formed by layering film and metal. It is highly flexible and can reportedly be easily bonded to materials requiring electromagnetic shielding. It is expected to reduce weight by more than 80% compared with conventional metal products, while electromagnetic shielding performance is reported to be 99.99%.