Ebara-Udylite has announced plans to change its company name to JCU effective 1 October. The company’s performance was discussed in the context of the trend toward higher density and thinner circuit boards for smartphones.
Ebara-Udylite is scheduled to change its company name to JCU from 1 October and operates a business supplying chemicals and equipment for plating. It provides chemicals used across a wide range of fields, including automobiles, construction materials, plumbing fixtures, electronic components and semiconductors, and its technology is positioned as a core element supporting the internal components of smartphones.
The company announced an upward revision to its forecast for the current fiscal year based on its first-quarter results. At a time when the proportion of listed companies making upward revisions is low, the company’s revision is relatively favourable. Upward revisions are also at a low level across the chemical industry, making the company’s revision a valuable improvement.
The company’s strength lies in its technology for responding to the higher density and thinner profiles of smartphone circuit boards. As a new manufacturing process known as the Any Layer structure becomes more widespread, demand is strong for filling chemicals used to connect the various layers. The company is said to have a global market share of more than 50% for filling chemicals, which are reportedly used by Samsung and in iPhones.
The company is also known as a successful example of an MBO fund investment, and its president has described the initiative as a search for “the second Udylite.” Although the business environment remains challenging this fiscal year, Ebara-Udylite was presented as a company likely to remain of interest, alongside the number of companies making upward revisions.