ウインテスト begins full-scale expansion of its semiconductor front-end inspection equipment business. It is moving forward with signing an NDA and holding joint discussions with a major overseas company ahead of the rollout from March 2027.
ウインテスト announced plans to launch full-scale operations in the semiconductor front-end inspection equipment business and said it would proceed with delivery and installation at a site targeting the establishment of mass-production capacity in Q4 2027. The company plans to complete a 300mm-scale plant in Japan in 2028 and has begun discussions with a major overseas semiconductor company.
The company introduced equipment lines for thin-film thickness and shape inspection, centered on the WTS-350FD and WTS-300FD, as well as the EFILM FD and EPROFILE FD series. The former features nanometer-level measurement of thin-film thickness and precise HKMG measurement, while the latter can accurately evaluate parameters for complex three-dimensional shapes.
While proceeding with construction of a cleanroom at its Osaka facility for the assembly, adjustment, evaluation and demonstration of front-end inspection equipment, the company has experienced delays in procuring components due to geopolitical tensions and the logistics environment, resulting in some changes to the construction work. Nevertheless, it continues to pursue its policy of establishing the necessary operating structure by the end of 2026 and launching full-scale operations in March 2027.
The company received specific inquiries from a major company in the Middle East, signed an NDA and began discussions on inspection processes, required specifications and equipment configurations. The delivery and installation site is targeting the establishment of mass-production capacity in Q4 2027, and the company plans to complete a domestic plant in 2028. For overseas evaluation using production equipment, it has delivered equipment to a cooperating customer company in Singapore and is proceeding with evaluation.