The Nikkei 225 is expected to open approximately ¥600 below the previous day's close on the 29th, with lower US semiconductor stocks and the ex-dividend date weighing on the market. As the 29th is the ex-dividend date, selling is expected to spread with around ¥65,300 seen as the downside level for the Nikkei 225.
The Nikkei 225 is expected to fall below the previous day's close of ¥65,877 on the 29th, with a decline of approximately ¥600 anticipated. The fall in AI-related and semiconductor stocks in the US market is expected to affect the Tokyo market as well.
In the domestic market, the trend of lower US stocks is expected to intensify selling pressure on related shares, with particular attention on AI- and semiconductor-related stocks.
As the 29th is the ex-dividend date, it is expected to push the Nikkei 225 down by approximately ¥300. The Nikkei 225 is therefore expected to find support around ¥65,300.
Following US stock market conditions on the 28th, domestic equities are expected to remain cautious, making the prospect of downside in the Nikkei 225 increasingly tangible.