A new technology using zirconia sol is reported to have been developed, increasing the polishing speed of SiC wafers by 1.6x. The company involved is Daiichi Kigenso Kagaku Kogyo.
Daiichi Kigenso Kagaku Kogyo is reported to have increased SiC wafer polishing speed by 1.6x compared with the conventional level, using a new method that employs zirconia sol as a polishing material. The article explains that this is expected to improve the efficiency of wafer processing.
The article focuses on improving the polishing process through the use of zirconia sol, and does not provide numerical information such as the specific implementation date or details of the test results. The outlook for commercialization and the scope of application are expected to become clearer in subsequent reports.