A demonstration project has begun to use AI to assess dirt and damage to the cardboard outer packaging of home appliances, with the aim of reducing returns and improving logistics efficiency.
The Home Appliance Supply Chain Council, the Distribution Economics Institute of Japan, Fujitsu and SoftBank Robotics began a demonstration project on 2 November to use AI to assess dirt and damage to the cardboard outer packaging of home appliances. The project will run through 15 January 2027 and will be conducted with support from a subsidy program promoting behavioral change among shippers and logistics operators through the use of digital technology.
The project aims to reduce excessive returns and redelivery by standardizing and unifying the criteria used when items are returned because of damage to their outer packaging. It will combine Fujitsu's image recognition platform "Fujitsu Kozuchi" with SoftBank Robotics' AI solution to verify operational suitability at logistics sites and develop assessment criteria.
The parties involved are examining the potential to improve logistics efficiency across the supply chain and reduce CO2 emissions by standardizing decisions on whether to return items with damaged outer packaging during the logistics process from manufacturers to mass retailers. Assessment results from the AI are expected to be recorded and shared using images taken with smartphones.
The project also envisages expansion into industries beyond home appliances, with the aim of building a highly transparent decision-making environment through the development of common standards and the use of data. Its status as a subsidy project of the Ministry of Land, Infrastructure, Transport and Tourism is also stated.