芝浦メカトロニクス announced that it had begun sales of its HSM-1000 hybrid bonding pre-treatment equipment for advanced semiconductor packages. The announcement was made on 24 September 2026.
芝浦メカトロニクス, a semiconductor manufacturing equipment maker, announced that it had begun sales of its HSM-1000 hybrid bonding pre-treatment equipment for advanced semiconductor packages.
The company formally announced the start of sales of the new product and specified its positioning as pre-treatment equipment for advanced semiconductor packages.
The product is named HSM-1000, and the announcement regarding the start of sales was made on 24 September 2026.