Intel held a ceremony in Japan to mark the 50th anniversary of the establishment of its Japanese subsidiary. It indicated that it would expand collaboration in areas including advanced packaging, using Japanese companies' materials and manufacturing technologies to strengthen cooperation in the AI era.
On 7 October, Intel held a ceremony at the Imperial Hotel in Tokyo to mark the 50th anniversary of the establishment of its Japanese subsidiary. Approximately 400 people, including CEO Lip-Bu Tan, government officials and executives from Japanese companies, attended. At the ceremony, Intel outlined plans to strengthen collaboration with Japan.
CEO Tan said that Japan is an important market for Intel and spoke highly of the technological capabilities developed by Japanese companies in areas such as organic substrates and factory automation. He indicated an intention to deepen collaboration further in areas including advanced packaging technologies.
He also touched on the importance of materials and manufacturing technologies supporting semiconductor production. The role of Japanese companies in developing AI semiconductors was emphasized, including improved multi-core interconnect performance using interconnect technologies such as EMIB-T and TSV. The more than 40-year collaboration with FUJIFILM Holdings and initiatives to ensure stable materials quality were introduced.
Collaboration with Rakuten Group and government support were also mentioned. As the Japanese government sets out semiconductor investment targets as part of a large-scale investment plan through 2040, Intel indicated a policy of participating in joint research, including SATAS and Z-Angle Memory. The content suggested that further collaboration announcements with Japanese companies may be forthcoming.