It was reported on the 27th that major chemical company Mitsubishi Chemical Group had developed a new negative thermal expansion filler for semiconductor packaging materials and was seeking to commercialize it.
Mitsubishi Chemical Group, a major chemical company, announced that it had developed a new negative thermal expansion filler for semiconductor packaging materials. This article reports on the development and states that the product is intended for use in semiconductor packaging materials.
Information dated the same day stated that development of the filler was announced on the 27th and that efforts toward commercialization were progressing. The article states that it was last updated at 14:07 on 27 August.