TAIYO TECHNOLEX CO.,LTD. announced that it had established manufacturing technology for four-layer FPCs using the MSAP process. The stock gained momentum in the afternoon session, at one point trading 14% higher than the previous day.
TAIYO TECHNOLEX CO.,LTD. announced that it had established manufacturing technology for four-layer flexible printed circuit boards (FPCs) using the MSAP process, which forms circuits by laminating copper. The stock rebounded into the afternoon session as the announcement was viewed as a market catalyst.
The company explained that the MSAP process enables more precise control of line width than conventional etching, and that laminating copper allows the sides of the wiring to be formed in a shape close to vertical. This is expected to improve the dimensional accuracy of fine-pitch wiring and enable circuit formation suited to high-frequency and high-speed transmission applications.
The company's announcement was viewed as a market catalyst, and attention is expected to focus on specific applications and developments in mass-production capacity. Depending on the market response, related materials and capital investment trends may also attract interest.