Unitika has developed “UMI-0,” a low-dielectric bismaleimide resin for advanced semiconductor package substrate materials, established mass-production capabilities and begun customer adoption. The company is targeting ¥1 billion in sales by 2030.
Unitika has developed “UMI-0,” a bismaleimide resin with low-dielectric properties for advanced semiconductor package substrate materials, established mass-production capabilities and begun efforts to secure customer adoption. The company will proceed with supplying the resin as a substrate material that addresses demand for high-speed signal transmission.
UMI-0 is a thermosetting bismaleimide resin that is liquid at room temperature. It features a low dielectric loss tangent, improved compatibility and reduced viscosity. The company says its flexible aliphatic backbone design and high-purity technology help suppress cracking caused by thermal stress and reduce interfacial delamination.
Unitika is expanding sales in Japan and overseas and is also considering applications beyond advanced semiconductor package substrates, including conductive pastes and high-heat-resistant adhesives. The company has set a target of ¥1 billion in sales in 2030.