ティアンドエスグループ has signed a basic agreement with TMH to form a business alliance aimed at providing solutions for the semiconductor industry. The first initiative will prioritize software staffing and maintenance and operations services, with plans to expand eventually into new system development and large-scale upgrades.
ティアンドエスグループ has signed a basic agreement with TMH to form a business alliance aimed at providing solutions for semiconductor manufacturers and equipment manufacturers. The two companies aim to establish a framework for addressing challenges at manufacturing sites from both hardware and software perspectives.
As the first initiative under the alliance, the companies will prioritize the rollout of software engineer staffing and system maintenance and operations services. Services will include the maintenance and operation of existing systems, the development and operation of peripheral systems, data integration, visualization and reporting, as well as the provision of additional engineering resources.
Once the first initiative is firmly established, the companies plan to gradually expand the scope of the alliance to include contract development of new systems and the construction and large-scale upgrading of core systems. In regions including Kyushu and Tohoku, where semiconductor factories are concentrated, they will consider securing personnel and improving their ability to serve customers through collaboration between and shared use of locations.
Going forward, the two companies plan to strengthen the provision of integrated hardware and software solutions by leveraging their knowledge of manufacturing sites and customer bases.