China’s Huawei Technologies unveiled its tri-fold smartphone, the Mate XT2, in Guangzhou. The device is powered by the new Kirin 9050 Pro chip, which stacks logic layers three-dimensionally.
Huawei Technologies officially unveiled its new tri-fold smartphone, the Mate XT2, in Guangzhou.
The device is powered by the high-performance Kirin 9050 Pro chip, which is the first to use logic-folding technology.
The Kirin 9050 Pro stacks the logic circuits within a single chip three-dimensionally rather than on a plane, and incorporates vertical interconnect paths inside the chip. This shortens signal transmission distances, reducing latency and improving performance, according to the company.
It has been approximately 6 years since Huawei last unveiled a new Kirin chip at one of its flagship product launches, when it introduced the Mate40.