Partial supply began under the Tomakomai Industrial Water Distribution Facilities Construction Project, with 日水コン responsible for the design and construction of Distribution Pipeline Section 1 and the relay pumping station. A water conveyance ceremony was held on 8 October, and supply to the next-generation semiconductor plant in Chitose will be expanded in stages.
Under the Tomakomai Industrial Water Distribution Facilities Construction Project in Hokkaido, partial industrial water supply to the Tomakomai industrial water system began in the presence of the project participants, including 日水コン. The supply volume is 8,000 cubic meters per day, and plans are under way to expand supply across the entire route.
The project includes the development of all three sections of the distribution pipeline connecting Tomakomai and Chitose, as well as a relay pumping station, to supply water to Rapidus’s next-generation semiconductor plant in Chitose. 日水コン is responsible for two assignments: Distribution Pipeline Section 1 and the relay pumping station construction.
The contract periods are February 2024 to February 2027 for Distribution Pipeline Section 1 and November 2024 to September 2027 for the relay pumping station construction. Total construction costs are approximately ¥3.2 billion and ¥2.6 billion, respectively. 日水コン’s assigned work comprises design and construction management, and design and construction supervision.
Following completion of the remaining section from the main-line branch to the relay pumping station and completion of the relay pumping station, full contracted supply of 24,000 m³ per day is expected to begin in April 2027.