Canon announced that it will launch a new krypton fluoride (KrF) exposure system in early December. Throughput will improve by approximately 30% versus the previous model, increasing the number of wafers exposed per hour to 400. The new system also offers options that allow flexible wavelength selection.
Canon announced that it will launch a new KrF exposure system in early December. The product has been revamped for the first time in approximately 10 years, improving throughput by approximately 30% versus the previous model and supporting the stacking of semiconductor devices.
The new product is designed to reduce wafer-stage movement time and increase exposure capacity to 400 wafers per hour. It also offers options for flexible selection of the wavelength used for alignment, targeting a broad range of semiconductor applications.
Canon anticipates increased demand for exposure with relaxed circuit line widths and noted that replacing conventional ArF exposure processes with KrF could create opportunities to contain costs. Canon and ASM compete for market share, and Canon aims to expand its share with this revamp.
The new product is being introduced to address the sharp increase in semiconductor investment, and Canon indicated its intention to strengthen both its supply and manufacturing capabilities.