To accelerate 3nm capacity expansion, TSMC is adding 1 new plant in Tainan and has begun installing equipment at its second plant in Arizona, US. The company has announced that Japan aims to begin volume production in the first half of 2028.
TSMC, the world's largest semiconductor foundry, has decided to add 1 3nm plant at the Southern Taiwan Science Park in Tainan in response to strong demand for 3nm products. Volume production is scheduled to begin in the first half of 2027 to meet rising customer demand. The additional capacity at the new plant is scheduled to begin volume production in the first half of 2028.
The plan calls for expanding supply capacity across multiple regions by using the new plant in Tainan as a starting point, followed by the introduction of 3nm production in the US and Japan, factory construction and equipment upgrades in multiple regions, and improvements in production efficiency. CEO 魏哲家 explicitly confirmed the additional plan at a briefing.
In the US, equipment installation has begun at the second plant in Arizona, and preparations for local production are advancing. Japan is targeting volume production in the first half of 2028, with efforts under way to strengthen 3nm production capacity in each region.
The move combines investment and equipment conversion to meet strong customer demand, with the aim of expanding 3nm supply capacity across multiple regions.