The Japanese and US governments have announced an agreement to pursue a semiconductor manufacturing project in New York State with an investment of approximately ¥1.6 trillion, as part of their strategic investment initiative. The project includes potential future expansion of production facilities, with construction targeted to begin in 2026.
The Ministry of Economy, Trade and Industry announced on the 15th that Japan and the United States will pursue a mature-node semiconductor manufacturing project in New York State as part of their strategic investment initiative. The total project value is $10 billion, or approximately ¥1.6 trillion, with the potential for the capital scale to expand to $21 billion through additional production facilities in the future. Construction is expected to begin in 2026.
The project will target semiconductors for automobiles, industrial machinery and smartphones, among other applications. By increasing manufacturing capacity in the United States, it aims to strengthen the semiconductor supply chain.
Tokyo Electron and SCREEN Holdings have expressed interest in supplying manufacturing equipment, Tokyo Ohka Kogyo in supplying materials, and Renesas Electronics in purchasing the products. Fujikin and 草川精機 are also expected to be involved in related supply activities.