Noritake announced the development of LumiDia, a polishing pad that uses only water in the SiC wafer polishing process. It contains diamond abrasives, eliminating the need for slurry.
Noritake announced on 2 September 2026 that it had developed LumiDia (ルミディア), a polishing pad containing diamond abrasives for use in the polishing process for silicon carbide (SiC) wafers.
The new pad is designed to polish using only water and is noted for not requiring slurry. It uses a structure in which the diamond abrasives are embedded within the pad.
The announcement was made by Noritake and suggests that the product could help conserve resources and simplify the polishing process for SiC wafers.