Machinery companies in Ishikawa Prefecture are moving to capture robust semiconductor demand. They are strengthening their semiconductor manufacturing equipment businesses and seeking to expand sales by applying technologies from their established areas of expertise.
Semiconductor manufacturing in Ishikawa Prefecture is divided into 2 stages: the front-end process, which produces thin, disk-shaped wafers used as substrates, and the back-end process, which cuts the wafers into individual chips and connects them. This article provides an overview of how machinery companies in the region are capturing this demand and responding to it.
The article describes how companies such as 中村留精密工業 of Hakusan, Ishikawa, and BBS金明 are strengthening their initiatives in the semiconductor manufacturing equipment field. It suggests a policy of expanding their existing semiconductor-related equipment businesses and pursuing market expansion by leveraging the region's strengths.
To respond to growing semiconductor demand, companies are repurposing existing processing technologies for new applications, including the use of grinding technologies for machine tools and technologies for weaving machinery. Machinery companies in Ishikawa aim to provide products and solutions that draw on their technical capabilities for a range of processes in semiconductor manufacturing, including both front-end and back-end processes.