Hokkaido's semiconductor cluster strategy calls for government support for Rapidus and more than ¥7 trillion in investment, with the construction of a 2nm-generation manufacturing facility and the start of mass production at its core as Japan seeks to rebuild its semiconductor industry.
In February 2023, Rapidus decided to build IIM-1, a next-generation semiconductor manufacturing facility, in Chitose, Hokkaido. The company launched a pilot line in April 2025 and plans to begin mass production in the second half of fiscal 2027. Initial monthly output is expected to be several thousand wafers, with plans to eventually increase capacity to approximately 25,000 wafers per month. Through post-5G initiatives, the government has provided more than ¥2.4 trillion in cumulative R&D support since fiscal 2022.
In addition, approximately ¥417.6 billion has been raised through government and private-sector investment. Hokkaido's strategic industry cluster plan targets ¥7.027 trillion in public- and private-sector capital investment, ¥31.3591 trillion in increased value added, and the development of 12,805 people by 2040. The customer mix and order outlook after the start of mass production will be key issues for evaluation going forward.
The scale of the policy support will test not only the success of Rapidus itself but also the rebuilding of Japan's semiconductor industry's overall competitiveness. While the Hokkaido cluster aims to establish 2nm-generation technology, its success will hinge on whether it can build an industrial base and attract sustained investment from private-sector capital.