Demand for copper-clad laminates (CCL) and prepreg in Japan is expected to expand, driven by the increasing use of components for EVs and the expansion of mass production of advanced semiconductor packages. The article outlines product types, applications and trends among major companies.
Demand for CCL and prepreg in Japan is being driven mainly by the electrification of automobiles and the expansion of mass production of semiconductor package substrates. A rapid shift is under way toward high-heat-dissipation materials for EVs and low-dielectric-loss materials for automotive radar and millimeter-wave applications, accelerating the replacement of conventional FR-4 with high-frequency materials. For AI accelerators used in data centers and server boards, a combination of low-roughness copper foil and low-dielectric-constant prepreg has become essential, increasing the importance of technologies that control dielectric properties. In addition, rising raw-material costs resulting from the weaker yen and the need to comply with environmental regulations are driving demand for non-halogenated flame retardants and investment in solvent-free processes.
Supply-chain restructuring associated with the construction of new semiconductor plants in Japan is also under way, and stable procurement of domestically produced high-purity epoxy and specialty curing agents is expected to be key to competitiveness. By product type, copper-clad laminates and prepreg are the main categories; they are selected according to the application, as substrate materials and resin-impregnated materials, respectively. Applications include computers, communications, consumer electronics, automotive electronics, industrial and medical equipment, and military and aerospace equipment.