Mitsui Mining & Smelting announced plans to build a new plant in Malaysia to produce carrier-attached ultra-thin copper foil "MicroThin" and electrolytic copper foil for high-frequency circuit boards, "VSP." Total investment is approximately ¥190 billion, with operations scheduled to begin in stages from April 2021.
Mitsui Mining & Smelting will build a new plant in Malaysia to produce carrier-attached ultra-thin copper foil MicroThin and electrolytic copper foil for high-frequency circuit boards, VSP. The investment will cover land, buildings and production equipment, with total investment expected to be approximately ¥190 billion.
The plant is scheduled to begin operations in stages from April 2031, with the aim of expanding copper foil production capacity and strengthening the supply system for high-performance copper materials.