Ibiden, headquartered in Ogaki, Gifu Prefecture, is reported to have become the global market-share leader in IC package substrates and has sharply raised its consolidated earnings forecast for the fiscal year ending March 2027. It also announced an investment plan totaling approximately ¥500 billion.
Ibiden's core businesses include IC package substrates and printed wiring boards. The company provides high-performance package substrates designed for high-density assembly, primarily to NVIDIA and Intel. As the importance of back-end processes increases, Japanese companies are regarded as having advanced manufacturing capabilities, and Ibiden is considered to hold a strong position in the global market.
Based on the financial results briefing for the first quarter of the fiscal year ending March 2027, announced on 4 August 2026, Ibiden sharply raised its consolidated earnings forecast for the full fiscal year. Net sales are projected at ¥550 billion and operating profit at ¥127 billion.
In an article accompanied by photographs, the company approved an investment plan totaling approximately ¥500 billion over the three years from fiscal 2026, centered on factory buildings at its Kawama facility. The company will arrange its funding by first receiving advance payments from NVIDIA and Intel.
The first-quarter financial results briefing announced on 4 August 2026 reported consolidated net sales of ¥123.219 billion and operating profit of ¥26.880 billion for the fiscal year ending March 2027, both up year on year. These results form the basis for the upward revision to the full-year forecast for the fiscal year ending March 2027.