Worth reading
27Immaterial
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Improvement
Direction inferred from the company’s description.Scale
—
Displayed only when the document provides numerical figures.Wording
Definitive
How definitive the wording is.Who is moving to which position
Incoming appointee
6 itemsScheduled Appointment Date1 October 2026
Harada Hidenobu (原田 英信)
Previous positionExecutive Officer, Head of Semiconductor Device Division 4 and Head of Renesas Business Operations Department
New positionExecutive Officer, Head of Semiconductor Device Division 4, Head of Semiconductor Device Division 6 and Head of Renesas Business Operations Department
Koba Takao (古場 貴雄)
Previous positionHead of Semiconductor Technology Division 2, Semiconductor Technology Division
New positionHead of Semiconductor Technology Division 2 and Head of Semiconductor Technology Department 4, Semiconductor Technology Division
Otsu Keisuke (大津 啓介)
Previous positionHead of Semiconductor Device Division 1
New positionHead of Semiconductor Device Division 1 and Head of Semiconductor Department 2
Murakami Masaya (村上 雅也)
Previous positionHead of Semiconductor Department 2, Semiconductor Device Division 1
New positionGeneral Manager of Semiconductor Device Division 6 and Head of West Japan Sales Department
Shimojo Masato (下条 雅人)
Previous positionSemiconductor Department, Semiconductor Device Department 4, Semiconductor Device Division 2
New positionHead of Central Japan Sales Department, Semiconductor Device Division 6
Kagawa Yoshiyuki (香川 佳之)
Previous positionRenesas Business Operations Department, Semiconductor Device Division 4
New positionHead of East Japan Sales Department, Semiconductor Device Division 6
Details of organizational changes
The company will establish Semiconductor Device Division 6 and Semiconductor Technology Department 4 within the Semiconductor Technology Division.
| Item | Details |
|---|---|
| Scheduled Appointment Date | 1 October 2026 |
| Name of appointee | Harada Hidenobu (原田 英信), Koba Takao (古場 貴雄), Otsu Keisuke (大津 啓介), Murakami Masaya (村上 雅也), Shimojo Masato (下条 雅人), Kagawa Yoshiyuki (香川 佳之) |
| Appointee's new position | Executive Officer, Head of Semiconductor Device Division 4, Head of Semiconductor Device Division 6 and Head of Renesas Business Operations Department, Head of Semiconductor Technology Division 2 and Head of Semiconductor Technology Department 4, Semiconductor Technology Division, Head of Semiconductor Device Division 1 and Head of Semiconductor Department 2, General Manager of Semiconductor Device Division 6 and Head of West Japan Sales Department, Head of Central Japan Sales Department, Semiconductor Device Division 6, Head of East Japan Sales Department, Semiconductor Device Division 6 |
| Appointee's previous position | Executive Officer, Head of Semiconductor Device Division 4 and Head of Renesas Business Operations Department, Head of Semiconductor Technology Division 2, Semiconductor Technology Division, Head of Semiconductor Device Division 1, Head of Semiconductor Department 2, Semiconductor Device Division 1, Semiconductor Department, Semiconductor Device Department 4, Semiconductor Device Division 2, Renesas Business Operations Department, Semiconductor Device Division 4 |
| Details of organizational changes | The company will establish Semiconductor Device Division 6 and Semiconductor Technology Department 4 within the Semiconductor Technology Division. |
Items this document does not state (16)
Resolution dateDate of departureAppointee's date of birthYear the appointee joined the CompanyNumber of shares held by the appointeeName of departing officerFormer position of departing officerNew position of departing officerReason for departureWhether the incumbent will remain in officeReason for changeReasons for appointmentNumber of directors after the changeFiling as an independent officerChange in Corporate Governance StructureSubject to Approval by the General Meeting of Shareholders
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.To accelerate achievement of the goals of the medium- to long-term management plan, GIC30, which begins in the fiscal year ending March 2027.
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