Announced details
The back-surface protective tape is stated to have a high market share. Specific figures are Not disclosed.
LINTEC Corporation applied for and received an award in the awards organized by the Japan Institute of Invention and Innovation. Capital, personnel and business relationships are Not disclosed.
A public interest incorporated association that organizes the Regional Invention Awards. Japan is divided into 8 regions, and engineers, research and development personnel and others who have created outstanding inventions, devices and designs are recognized. Other information, including its location, representative, capital and year of establishment, is Not disclosed.
FY2026 Kanto Regional Invention Awards: Tokyo Governor’s Award
FY2026 Kanto Regional Invention Awards: Invention Encouragement Award
Japan Institute of Invention and Innovation
Patent No. 6228343
Patent No. 6779235
In this announcement the company addresses none of Contract Value / Offering price / Impact on Business Performance.
FY2026 Kanto Regional Invention Awards organized by the Japan Institute of Invention and Innovation
| Item | Details |
|---|---|
| Names of Products / Services Covered | Back-surface protective tape for flip-chip mounting, Fixing material for LEDs |
| Counterparty | Japan Institute of Invention and Innovation |
| Counterparty overview | A public interest incorporated association that organizes the Regional Invention Awards. Japan is divided into 8 regions, and engineers, research and development personnel and others who have created outstanding inventions, devices and designs are recognized. Other information, including its location, representative, capital and year of establishment, is Not disclosed. |
| Relationship with the Company | LINTEC Corporation applied for and received an award in the awards organized by the Japan Institute of Invention and Innovation. Capital, personnel and business relationships are Not disclosed. |
| Applicable area | Flip-chip mounting of semiconductor chips, Semiconductor and electronic component-related products, Optical device mounting for high-brightness, high-power LEDs |
| Award/certification name | FY2026 Kanto Regional Invention Awards: Tokyo Governor’s Award, FY2026 Kanto Regional Invention Awards: Invention Encouragement Award |
| Awarding / certifying body | Japan Institute of Invention and Innovation |
| Registration number and expiry date | Patent No. 6228343, Patent No. 6779235 |
| Usage history | The back-surface protective tape is stated to have a high market share. Specific figures are Not disclosed. |
| Source | FY2026 Kanto Regional Invention Awards organized by the Japan Institute of Invention and Innovation |
Items this document does not state (8)
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.The awards were granted because the inventions were recognized as outstanding at the Regional Invention Awards organized by the Japan Institute of Invention and Innovation. The back-surface protective film blocks visible light while transmitting infrared light, enabling non-destructive inspection for internal defects with the protective tape still applied. The LED fixing material is described as resolving the trade-off between adhesive performance, transparency and optical properties.