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Other Disclosures7966LINTEC CorporationInformation and Communications, Services and Others

Developed a resin microneedle patch

LINTEC CORPORATION, in collaboration with Teikyo Heisei University, developed a resin-based microneedle patch that is applied to the skin to provide stimulation. The project is now moving into the stage of evaluating and verifying its effects and conducting research to improve the product; no announcement has been made regarding a commercial launch or other matters.

Worth reading
57In focus
0–100. This measures how worthwhile something is to read, not how good or bad the company is.
Direction
Neutral
Direction inferred from the company’s description.
Scale
16
A study involving 16 adult men
Wording
Conditional
How definitive the wording is.

Announced details

Resin-based microneedle patch
Applicable field (uses covered by this announcement)

Treatment at acupuncture and moxibustion clinics and similar facilities, home healthcare, and the healthcare sector

What the company reported numerically
Quantitative Effects

In a study involving 16 adult men, a localized increase in blood flow was confirmed when the patch was applied

Relationship between the counterparty and the company
LINTEC Corporation7966
Relationship with the Company

Joint development. Collaborating with the Institute of Oriental Medicine at Teikyo Heisei University

CounterpartyTeikyo Heisei University

A university that conducts research in oriental medicine. Its Institute of Oriental Medicine conducts research on acupuncture and moxibustion, among other areas. Location, representative, capital and year established: not disclosed

Registration number and expiry date

Patent application pending (number and filing date: not disclosed)

Location (as indicated in this announcement)

Bunkyo Garden Gate Tower 8F, 1-1-1 Koishikawa, Bunkyo-ku, Tokyo (contact for inquiries regarding the product under development)

In this announcement the company addresses none of Contract Value / Offering price / Impact on Business Performance.

Source (materials cited by the company)

Research findings presented at the Annual Scientific Meeting of the Japan Society of Acupuncture and Moxibustion

Announced details
ItemDetails
Names of Products / Services CoveredResin-based microneedle patch
CounterpartyTeikyo Heisei University
Counterparty overviewA university that conducts research in oriental medicine. Its Institute of Oriental Medicine conducts research on acupuncture and moxibustion, among other areas. Location, representative, capital and year established: not disclosed
Relationship with the CompanyJoint development. Collaborating with the Institute of Oriental Medicine at Teikyo Heisei University
Applicable areaTreatment at acupuncture and moxibustion clinics and similar facilities, home healthcare, and the healthcare sector
Registration number and expiry datePatent application pending (number and filing date: not disclosed)
LocationBunkyo Garden Gate Tower 8F, 1-1-1 Koishikawa, Bunkyo-ku, Tokyo (contact for inquiries regarding the product under development)
Quantitative EffectsIn a study involving 16 adult men, a localized increase in blood flow was confirmed when the patch was applied
SourceResearch findings presented at the Annual Scientific Meeting of the Japan Society of Acupuncture and Moxibustion
Items this document does not state (9)
Contract ValueOffering priceContract DateLaunch dateAward/certification nameAwarding / certifying bodyLocation scaleUsage historyImpact on Business Performance

These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.

The reasons the company gives

The company's own explanation, not something inferred from the numbers.

The patch was developed in collaboration with Teikyo Heisei University as part of an initiative to create new products and businesses from a medium- to long-term perspective, without being constrained by the framework of existing operations.

How to read this page

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Developed a resin microneedle patch | LINTEC Corporation (7966) timely disclosure | Komori