Announced details
The company states that it will conduct joint research with external research institutions and companies, as well as materials evaluation and process verification with customers present, but the specific counterparties and relationships are not disclosed.
Within the research institute in Saitama, Saitama Prefecture (Advanced Technology Building)
In this announcement the company addresses none of Contract Value / Offering price / Impact on Business Performance.
| Item | Details |
|---|---|
| Names of Products / Services Covered | Advanced Development Center, Semiconductor-related tapes, Materials and processes related to direct transfer bonding (DTB) |
| Relationship with the Company | The company states that it will conduct joint research with external research institutions and companies, as well as materials evaluation and process verification with customers present, but the specific counterparties and relationships are not disclosed. |
| Launch date | 8 June 2026 (already established; actual) |
| Applicable area | Advanced semiconductors for AI applications, HBM (high-bandwidth memory), Logic semiconductors, Chiplets, Hybrid bonding |
| Location | Within the research institute in Saitama, Saitama Prefecture (Advanced Technology Building) |
| Location scale | Total floor area: 158 m²; ISO Class 5/7 cleanrooms |
Items this document does not state (12)
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.To strengthen its materials and process development capabilities in advanced semiconductor fields, including AI applications, establish an evaluation environment close to a mass-production line, and promote joint research with external research institutions and companies, as well as materials evaluation and process verification with customers present.