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Zacros (7917) · InitiativeAdvanced

Adhesive and Electrically Conductive Bonding Materials for Flexible OLEDs and FPCs

First written in FY2017. 4 of 7 entries say "Advanced", first in FY2018. Latest entry: FY2025.

7entries
9years
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How it moved
ProgressHeldSoftenedWorseRestatedFY2019AdvancedFY2021 – FY20232017: 120172018: 120182019: 120192020: 020202021: 120212022: 020222023: 120232024: 120242025: 12025
Same theme, other companies
Development and expansion of bonding materials for flexible OLEDs and FPCsA theme 1 companies write about · 0 as a headwind · 1 as a tailwind

No other company in this theme has enough history to compare yet.

Full recordFilings, disclosures and news, newest first
  1. FY2025AdvancedAnnual report

    「For high-adhesion products, we expanded the lineup of adhesive products suited to thinner, higher-performance liquid-crystal displays and various display applications, and began developing film devices, composite products combining high-performance films with other materials.」

    In addition to expanding the adhesive product lineup, the Company began developing film devices, composite products combining high-performance films with other materials.
  2. FY2024RestatedAnnual report

    「For electronic circuit board products, amid growing demand for high-speed transmission using high frequencies as 5G becomes more widespread, we began developing electronic materials with low transmission loss. In the semiconductor-related field, we began developing adhesive film products compatible with next-generation technologies.」

    The Company reaffirmed its policy of developing low-transmission-loss materials for 5G and adhesive films for next-generation semiconductor processes.
  3. FY2023AdvancedAnnual report

    「For electronic circuit board products, amid growing demand for high-speed transmission using high frequencies driven by 5G, we began developing electronic materials with low transmission loss in the high-frequency range. In the semiconductor-related field, we also began developing process film products for use in the latest next-generation processes.」

    In addition to low-transmission-loss materials for 5G, the Company began developing films for next-generation semiconductor processes.
  4. FY2021AdvancedAnnual report

    「For high-adhesion products, we expanded the lineup of adhesive products, including adhesives suited to thinner, higher-performance liquid-crystal displays and various display applications, as well as film products compatible with 5G. For electronic circuit board products, amid growing demand for high-speed transmission using high frequencies driven by 5G, we began developing electronic materials with low transmission loss in the high-frequency range.」

    The Company began expanding its lineup of 5G-compatible film products and developing electronic materials with high-frequency performance and low transmission loss.
  5. FY2019RestatedAnnual report

    「For high-adhesion products, we expanded the lineup of adhesive products, including adhesives suited to thinner, higher-performance liquid-crystal displays and various display applications. For FPCs (flexible printed circuit boards), we developed an ultra-thin coverlay film for high-density mounting.」

    The Company reaffirmed the expanded adhesive product lineup and development of ultra-thin coverlay films for FPCs.
  6. FY2018AdvancedAnnual report

    「For surface-protection films for polarizing plates, we expanded the product lineup with low-contamination products that reduce peel charging voltage when removed, in response to changes in the component structure of polarizing plates. For high-adhesion products, we began selling adhesive products with light-diffusing functionality in response to thinner, higher-performance liquid-crystal displays and expanded the product lineup. For FPCs (flexible printed circuit boards), we developed an ultra-thin coverlay film for high-density mounting.」

    Progress was made in expanding the surface-protection film lineup, launching sales of light-diffusing adhesive products, and developing ultra-thin coverlay films.
  7. FY2017First statedAnnual report

    「We are also developing adhesive films used in the manufacturing process for flexible OLED displays, for which market expansion is expected. For high-adhesion products, we developed adhesive products incorporating light-diffusing functionality in response to the trend toward thinner, higher-performance liquid-crystal displays. For FPCs (flexible printed circuit boards), we began selling conductive adhesives for shielding.」

    The Company reported the development of adhesive films for flexible OLEDs, adhesive products with light-diffusing functionality, and conductive adhesives for FPCs, as well as the start of sales.
Moved together

"Expansion of Overseas Production and Sales" moved the same way as this thread, in the same document, in 4 of its 7 moves.

444333★123456
  1. ★This thread
  2. 1Expansion of Overseas Production and Sales4×
  3. 2Improving Operating Profit, Profit Margin and ROA4×
  4. 3Developing New Technologies and Products Through the Integration of Technologies4×
  5. 4Strengthening Growth Drivers3×
  6. 5Focus on efficiency3×
  7. 6Demand Fluctuations in Electrical and Electronics-Related Markets3×

★ is this thread; numbers match the list above. The number on a line is how many documents both moved the same way in; lines between the other threads count the documents they moved together in too. Threads that move together often sit closer.

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Adhesive and Electrically Conductive Bonding Materials for Flexible OLEDs and FPCs | ZACROS Corporation (7917) | Komori