Development of Inspection Technologies for High-Definition Small- and Medium-Sized LCDs and OLEDs and Expansion of Sales
First written in FY2016. 7 of 10 entries say "Restated". Latest entry: FY2023.
0 other companies' latest entry also says "Achieved".
- FY2023AchievedAnnual report
「The main themes during the consolidated fiscal year included the development of high-speed, high-resolution cameras and image-processing equipment. Development has been completed and the products have been launched.」
Development of the high-speed, high-resolution cameras and image-processing equipment was completed, and the products were launched. - FY2020RestatedAnnual report
「We also worked to improve product competitiveness by developing new inspection methods, including AI-based methods, and new products aimed at higher speeds.」
We continued developing new inspection methods, including AI-based methods, and new products aimed at higher speeds. - FY2019-Q3RestatedAnnual report
「We also worked to improve product competitiveness by developing high-speed, high-definition next-generation optical sensors and introducing new inspection methods into actual equipment that enable lower component costs.」
We continued developing next-generation optical sensors and implementing new inspection methods in actual equipment that enable lower component costs. - FY2019-Q2RestatedAnnual report
「We also worked to improve product competitiveness by developing high-speed, high-definition next-generation optical sensors and introducing new inspection methods into actual equipment that enable lower component costs.」
We continued developing next-generation optical sensors and implementing new inspection methods in actual equipment. - FY2019-Q1AdvancedAnnual report
「We also worked to improve product competitiveness by developing high-speed, high-definition next-generation optical sensors and introducing new inspection methods into actual equipment that enable lower component costs.」
In addition to developing next-generation optical sensors, we advanced the new inspection methods that enable lower component costs to the stage of implementation in actual equipment. - FY2018RestatedAnnual report
「The main theme during the consolidated fiscal year was the development of next-generation high-precision, high-speed image sensors for installation in semiconductor inspection equipment, among other areas, and development is ongoing.」
It was stated that development of next-generation high-precision, high-speed image sensors for semiconductor applications is ongoing. - FY2018-Q3RestatedAnnual report
「We also worked to improve product competitiveness by developing next-generation optical sensors offering high speed and high definition, as well as new inspection methods that enable lower component costs.」
We continued developing high-speed, high-definition next-generation optical sensors and new inspection methods. - FY2018-Q2RestatedAnnual report
「We also worked to improve product competitiveness by developing next-generation optical sensors offering high speed and high definition, as well as new inspection methods that enable lower component costs.」
We continued developing high-speed, high-definition next-generation optical sensors and new inspection methods. - FY2018-Q1RestatedAnnual report
「We also worked to improve product competitiveness by developing next-generation optical sensors offering high speed and high definition, as well as new inspection methods that enable lower component costs.」
We continued developing high-speed, high-definition next-generation optical sensors and new inspection methods as measures to upgrade inspection technology. - FY2016First statedAnnual report
「We recognize that an important challenge is to develop technology enabling even higher-definition inspection to meet customer needs for OLED display inspection.」
We continued to emphasize preparing the sales and outsourced production structures for high-definition small- and medium-sized LCDs, alongside technology development for OLEDs.