Strengthening the Semiconductor Testing Business through a Business Alliance and Business Acquisition
First written in FY2018-Q2. 3 of 6 entries say "Restated". Latest entry: FY2019-Q3.
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- FY2019-Q3RestatedAnnual report
「On 31 July 2018, we acquired the semiconductor wafer surface inspection equipment business (WM) and the proximity exposure equipment business (TME) in the semiconductor-related field from 株式会社トプコン and its subsidiary 株式会社トプコンテクノハウス. Going forward, through integrating the acquired businesses, including the appearance inspection equipment business (Vi) acquired in November 2017, with our existing businesses, we will further strengthen and expand our semiconductor-related inspection equipment business and work toward achieving our medium-term management plan.」
Following the acquisition of the WM and TME Businesses, we reaffirmed our policy of strengthening the semiconductor-related inspection equipment business by integrating the acquired businesses, including the Vi Business, with our existing businesses. - FY2019-Q2RestatedAnnual report
「Specifically, on 31 July 2018, we acquired the semiconductor wafer surface inspection equipment business (WM) and the proximity exposure equipment business (TME) in the semiconductor-related field from 株式会社トプコン and its subsidiary 株式会社トプコンテクノハウス. Going forward, through integrating the acquired businesses, including the appearance inspection equipment business (Vi) acquired in November last year, with our existing businesses, we will further strengthen and expand our semiconductor-related inspection equipment business and work toward achieving our medium-term management plan.」
Following the acquisition of the WM and TME Businesses, we reaffirmed our policy of strengthening the semiconductor-related inspection equipment business by integrating the acquired businesses, including the Vi Business, with our existing businesses. - FY2019-Q1AdvancedAnnual report
「On 18 June 2018, the Company entered into business transfer agreements with 株式会社トプコン and its subsidiary 株式会社トプコンテクノハウス for the semiconductor wafer surface inspection equipment business and the proximity exposure equipment business, and acquired those businesses from 株式会社トプコン and 株式会社トプコンテクノハウス under the agreements on 31 July 2018.」
The acquisition of the semiconductor wafer surface inspection equipment business and proximity exposure equipment business, for which agreements were signed in the previous fiscal year, was completed on 31 July 2018. - FY2018AdvancedAnnual report
「To strengthen our inspection equipment business for semiconductors and related products, our Group acquired the semiconductor-related appearance inspection equipment business (Vi) of the 株式会社トプコン Group in November 2017 to expand our development and sales capabilities, including sales channels, in this field. To further expand our product lineup and strengthen our development capabilities, we have now acquired the semiconductor wafer surface inspection equipment business (WM) and will work to strengthen our business in the field of inspection equipment for semiconductors and related products.」
Following the acquisition of the Vi Business, we entered into business transfer agreements for the semiconductor wafer surface inspection equipment business and the proximity exposure equipment business, with the acquisitions scheduled for 31 July 2018. - FY2018-Q3RestatedAnnual report
「Effective 1 November 2017, we acquired the appearance inspection equipment business in the semiconductor-related field, known as the Vi Business, from 株式会社トプコン and its subsidiary 株式会社トプコンテクノハウス. Going forward, we will integrate the acquired Vi Business with our existing businesses, strengthen and expand our semiconductor-related inspection equipment business through significant synergies, and work toward achieving our medium-term management plan.」
Based on the acquisition of the Vi Business, we reaffirmed our policy of strengthening and expanding the semiconductor-related inspection equipment business by integrating it with our existing businesses and generating synergies. - FY2018-Q2First statedAnnual report
「On 29 September 2017, the Company entered into a business transfer agreement with 株式会社トプコン and its subsidiary 株式会社トプコンテクノハウス for the transfer of an appearance inspection equipment business in the semiconductor-related field, and acquired the business from 株式会社トプコン and 株式会社トプコンテクノハウス under the agreement on 1 November 2017.」
To expand our development and sales capabilities in the field of inspection equipment for semiconductors and related products, we acquired the semiconductor-related appearance inspection equipment business from the Topcon Group. The acquired assets and rights included inventories, property, plant and equipment, patents, and contractual rights and obligations. The acquisition price was not disclosed.