Announced details
Semiconductor device manufacturing; semiconductor lines for prototyping
Developed a mosaic crystal capable of fabricating 2-inch wafers with a diameter of 50 mm
Process track record in the fabrication of numerous substrates and wafers
53×53×1.2 mm; 4 constituent single crystals; each individual crystal is at least 25×25 mm; one side polished to Ra approximately 5 nm
Already incorporated into the earnings forecast for the fiscal year ending March 2027. If sales conditions become clear and are expected to have a material impact on earnings, the company will disclose the information promptly.
The company does not address Contract Value / Offering price.
| Item | Details |
|---|---|
| Names of Products / Services Covered | 2-inch wafers; mosaic crystals for fabricating 2-inch wafers |
| Launch date | Second half of the fiscal year ending March 2027 (plan to establish a mass-production system) |
| Applicable area | Semiconductor device manufacturing; semiconductor lines for prototyping |
| Location scale | 53×53×1.2 mm; 4 constituent single crystals; each individual crystal is at least 25×25 mm; one side polished to Ra approximately 5 nm |
| Quantitative Effects | Developed a mosaic crystal capable of fabricating 2-inch wafers with a diameter of 50 mm |
| Usage history | Process track record in the fabrication of numerous substrates and wafers |
| Impact on Business Performance | Already incorporated into the earnings forecast for the fiscal year ending March 2027. If sales conditions become clear and are expected to have a material impact on earnings, the company will disclose the information promptly. |
Items this document does not state (11)
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.Because enlarging single crystals is difficult, the company sought to achieve larger wafers using mosaic crystals, which are made by connecting multiple single crystals horizontally. The company overcame challenges involving cracking and fractures caused by stress during crystal bonding, as well as the polishing of large-area mosaic crystals.