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Other Disclosures7794EDP CorporationInformation and Communications, Services and Others

Notice regarding the execution of a letter of intent to conduct joint research on materials for diamond devices with 株式会社本田技術研究所

The Company executed a letter of intent with 株式会社本田技術研究所 to begin discussions toward entering into a joint research agreement, with the scale-up and quality improvement of diamond wafers as the main themes. The parties are currently aiming to execute a formal joint research agreement in the future.

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Announced details

Materials for diamond devicesDiamond wafersDiamond substrates
Applicable field (uses covered by this announcement)

Power devices used in electric vehicles and other applications, and automotive semiconductor devices

Launch dateDevelopment is scheduled to begin after the formal joint research agreement is executed.
Contract DateLetter of intent: 19 March 2026. The parties aim to execute the formal joint research agreement by the end of August 2026.
Relationship between the counterparty and the company
EDP Corporation7794
Relationship with the Company

There are no capital or personnel ties, and the counterparty is not a related party. The Company has a track record of selling diamond substrates and wafers.

Counterparty株式会社本田技術研究所

1-4-1 Chuo, Wako, Saitama; Representative Director and President Otsu Keiji (大津啓司); research and development of transport equipment; stated capital of ¥7,400 million; established on 1 July 1960; 100% owned by HONDA MOTOR CO.,LTD.

Impact on Business Performance

No impact of this agreement on results for the current fiscal year was stated.

The company does not address Contract Value / Offering price.

Announced details
ItemDetails
Names of Products / Services CoveredMaterials for diamond devices, Diamond wafers, Diamond substrates
Counterparty株式会社本田技術研究所
Counterparty overview1-4-1 Chuo, Wako, Saitama; Representative Director and President Otsu Keiji (大津啓司); research and development of transport equipment; stated capital of ¥7,400 million; established on 1 July 1960; 100% owned by HONDA MOTOR CO.,LTD.
Relationship with the CompanyThere are no capital or personnel ties, and the counterparty is not a related party. The Company has a track record of selling diamond substrates and wafers.
Contract DateLetter of intent: 19 March 2026. The parties aim to execute the formal joint research agreement by the end of August 2026.
Launch dateDevelopment is scheduled to begin after the formal joint research agreement is executed.
Applicable areaPower devices used in electric vehicles and other applications, and automotive semiconductor devices
Impact on Business PerformanceNo impact of this agreement on results for the current fiscal year was stated.
Items this document does not state (10)
Contract ValueOffering priceAward/certification nameAwarding / certifying bodyRegistration number and expiry dateLocationLocation scaleQuantitative EffectsUsage historySource

These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.

The reasons the company gives

The company's own explanation, not something inferred from the numbers.

To advance the development of diamond materials and accelerate device development toward the practical application and mass production of diamond power devices.

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Notice regarding the execution of a letter of intent to conduct joint research on materials for diamond devices with 株式会社本田技術研究所 | EDP Corporation (7794) timely disclosure | Komori