Announced details
Suggested applications include next-generation thermal management materials, optimization of thermal conductivity, mountability and reliability, and substrate applications for semiconductors and other devices, but the specific industries are not disclosed.
Measured values include thermal conductivity of 170–225 W/m·K and flexural strength of 280–530 MPa. These are not product specification values.
The companies have a collaborative relationship involving the joint exhibition of collaborative products. Capital and personnel relationships are not disclosed.
The representative director is Nishitani Kenji (西谷 健治). The other information, including location, capital, year of establishment and business activities, is not disclosed.
West Exhibition Halls, Tokyo Big Sight (exhibition venue)
In this announcement the company addresses none of Contract Value / Offering price / Impact on Business Performance.
Measurements were conducted using the laser flash method, Archimedes method, a coordinate measuring machine, the TMA method, three-point bending and the SEPB method. The name of the external research institution is not disclosed.
| Item | Details |
|---|---|
| Names of Products / Services Covered | High-strength AlN substrates reinforced with ceramic fibers, Thermalnite® (サーマルナイト), U-MAP's high-performance thermal interface sheets and other thermal management products |
| Counterparty | U-MAP Co., Ltd. |
| Counterparty overview | The representative director is Nishitani Kenji (西谷 健治). The other information, including location, capital, year of establishment and business activities, is not disclosed. |
| Relationship with the Company | The companies have a collaborative relationship involving the joint exhibition of collaborative products. Capital and personnel relationships are not disclosed. |
| Launch date | 15 July 2026 (scheduled; the opening day of the exhibition) |
| Applicable area | Suggested applications include next-generation thermal management materials, optimization of thermal conductivity, mountability and reliability, and substrate applications for semiconductors and other devices, but the specific industries are not disclosed. |
| Location | West Exhibition Halls, Tokyo Big Sight (exhibition venue) |
| Location scale | Booth 3-F21. Other information on the scale is not disclosed. |
| Quantitative Effects | Measured values include thermal conductivity of 170–225 W/m·K and flexural strength of 280–530 MPa. These are not product specification values. |
| Source | Measurements were conducted using the laser flash method, Archimedes method, a coordinate measuring machine, the TMA method, three-point bending and the SEPB method. The name of the external research institution is not disclosed. |
Items this document does not state (8)
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.To provide visitors with an opportunity to see product samples in person.