Contents of this document
- Considering additional investment to expand production capacity
- Increase in the capital investment plan from ¥11 billion to ¥15 billion in connection with production capacity expansion investment
- Company-wide orders received658 Hundreds of millions of yenYear on year against the same period last year+83%
- Semiconductor manufacturing equipment orders received532 Hundreds of millions of yenYear on year against the same period last year+102%
- Measuring instruments orders received126 Hundreds of millions of yenYear on year against the same period last year+32%
- Company-wide order backlog1,085 Hundreds of millions of yen
- HPC-related sales ratio (semiconductor manufacturing equipment)Mid-40% range
- HPC-related orders received ratio (semiconductor manufacturing equipment)Above 40%
| Item | Details |
|---|---|
| Document type | Presentation materials for financial results |
| Fiscal Period Covered | First quarter of the fiscal year ending March 2027 |
| Net Sales | 367 Hundreds of millions of yen (YoY +19.0%) |
| Operating profit | 59 Hundreds of millions of yen (YoY +29.0%) |
| Ordinary income | 64 Hundreds of millions of yen (YoY +44.0%) |
| Net income | 47 Hundreds of millions of yen (YoY +45.0%) |
| Operating profit margin | 16%, up 1 percentage point year on year |
| Selling, general and administrative expenses | ¥9,479 million |
| Results for the three months of the current quarter | Net sales of ¥36.7 billion, operating profit of ¥5.9 billion, ordinary profit of ¥6.4 billion and net income of ¥4.7 billion. Orders received were ¥65.8 billion, capital investment was ¥1.9 billion and R&D expenses were ¥3.3 billion. |
| Full-year earnings forecast | Orders received Not disclosed / Net Sales 1,890 Hundreds of millions of yen / Operating profit 440 Hundreds of millions of yen / Ordinary income 440 Hundreds of millions of yen / Net income for the current fiscal year 308 Hundreds of millions of yen / Research and development costs 130 Hundreds of millions of yen / Capital Expenditure 150 Hundreds of millions of yen / Depreciation and amortization 62 Hundreds of millions of yen |
| Self-assessment against the plan | First-quarter results were broadly in line with the plan (R&D expenses, capital investment and depreciation). |
| Segment results | Semiconductor manufacturing equipment Orders received ¥53.2 billion (up 102% year on year) / Net Sales ¥28.5 billion (up 21% year on year) / Operating profit ¥5.4 billion (up 34% year on year) / Operating profit margin 19% (up 2 percentage points year on year) / Measurement Equipment Orders received ¥12.6 billion (up 32% year on year) / Net Sales ¥8.2 billion (up 12% year on year) / Operating profit ¥500 million (down 7% year on year) / Operating profit margin 6% (down 1 percentage point year on year) |
| Breakdown of Factors Affecting the Change | Semiconductor manufacturing equipment: Demand was strong for HPC projects, including generative AI, projects in China and other applications. Measuring instruments: The segment benefited from additional investment related to hybrid vehicle production, as well as demand from AI data centers, robots and other areas. A breakdown of the factors by amount was not disclosed. |
| Key KPIs | Indicator name Company-wide orders received / Value 658 Hundreds of millions of yen / Year on year against the same period last year +83%, Indicator name Semiconductor manufacturing equipment orders received / Value 532 Hundreds of millions of yen / Year on year against the same period last year +102%, Indicator name Measuring instruments orders received / Value 126 Hundreds of millions of yen / Year on year against the same period last year +32%, Indicator name Company-wide order backlog / Value 1,085 Hundreds of millions of yen / Year on year against the same period last year Not disclosed, Indicator name HPC-related sales ratio (semiconductor manufacturing equipment) / Value Mid-40% range / Year on year against the same period last year Not disclosed, Indicator name HPC-related orders received ratio (semiconductor manufacturing equipment) / Value Above 40% / Year on year against the same period last year Not disclosed |
| Assumptions Underlying the Business Outlook | The assumed exchange rate is ¥150 per dollar. For semiconductor manufacturing equipment, the company assumes an increase in demand and shipments, primarily in the second half, while for measuring instruments it assumes continued growth across the market as a whole. |
| Medium-term management plan targets | The materials state that the company aims to move closer to the targets of its medium-term management plan by increasing the proportion of high-value-added products and improving costs. Specific target figures and target years were not disclosed. |
| Annual Dividend | Annual Dividend ¥304 per share / Interim ¥152 per share / End of period ¥152 per share |
| Capital expenditures | ¥19 100 million (first-quarter actual) |
| Orders received and order backlog | Orders received ¥65.8 billion / Order backlog ¥108.5 billion |
| New initiatives | Considering additional investment to expand production capacity, Increase in the capital investment plan from ¥11 billion to ¥15 billion in connection with production capacity expansion investment |
Items this document does not state (11)
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.Demand was strong for semiconductor manufacturing equipment, including HPC applications such as generative AI, projects in China and general-purpose memory, while demand for measuring instruments also remained high in areas including hybrid vehicles, AI data centers, robots, and aerospace and defense. The capital investment plan was increased to fund investment aimed at expanding production capacity.